典型文献
Solid-liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient
文献摘要：
A novel solid-liquid interdiffusion(SLID)bonding method with the assistance of temperature gradient(TG)was carried out to bonding Cu and Ni substrates with Sn as interlayer.The element distribution and grain morphology of interfacial interme-tallic compound(IMC)in Cu/Sn/Ni micro-joints during both SLID and TG-SLID bonding and in the final Cu/(Cu,Ni)6Sn5/Ni full IMC micro-joints were analyzed.Under the effect of Cu-Ni cross-interaction,interfacial(Cu,Ni)6Sn5 dominated the IMC growth at all the interfaces.The morphology of the(Cu,Ni)6Sn5 grains was closely related to Ni content with three levels of low,medium and high.The full IMC micro-joints consisted of L-(Cu,Ni)6Sn5,M-(Cu,Ni)6Sn5 and H-(Cu,Ni)6Sn5 grains after SLID bonding or TG-SLID bonding with Ni as hot end,while only L-(Cu,Ni)6Sn5 grains after TG-SLID bonding with Cu as hot end,showing that the direction of TG had a remarkably effect on the growth and morphology of the interfacial(Cu,Ni)6Sn5 during TG-SLID bonding.Thermodynamic analysis revealed the key molar latent heat and critical Ni content between fine-rounded-like(Cu,Ni)6Sn5 and block-like(Cu,Ni)6Sn5 were 17,725.4 J and 11.0 at.％at 260℃,respectively.Moreover,the growth kinetic of the interfacial IMC was analyzed in detail during bonding with and without TG.Under the combination of TG and Cu-Ni cross-interaction,void-free full IMC micro-joints were fast formed by TG-SLID bonding with Cu as hot end.This bonding method may present a feasible solution to solve the problems of low formation efficiency and inevitable Cu3Sn growth of full IMC joints for 3D packaging applications.
文献关键词：
中图分类号：
作者姓名：
Yanqing Lai;Shi Chen;Xiaolei Ren;Yuanyuan Qiao;Ning Zhao
作者机构：
School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,China
文献出处：
引用格式：
[1]Yanqing Lai;Shi Chen;Xiaolei Ren;Yuanyuan Qiao;Ning Zhao-.Solid-liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient)[J].金属学报（英文版）,2022(11):1912-1924
A类：
Interdiffusion,SLID,tallic,6Sn5
B类：
Solid,liquid,Bonding,Micro,joints,Assistance,Temperature,Gradient,novel,solid,interdiffusion,bonding,method,assistance,temperature,gradient,was,carried,substrates,interlayer,element,distribution,morphology,interfacial,interme,compound,IMC,micro,during,both,final,full,were,analyzed,Under,effect,cross,interaction,dominated,growth,interfaces,grains,closely,related,content,three,levels,low,medium,high,consisted,after,hot,end,while,only,showing,that,direction,had,remarkably,Thermodynamic,analysis,revealed,key,molar,latent,heat,critical,between,fine,rounded,like,block,respectively,Moreover,kinetic,detail,without,combination,void,free,fast,formed,by,This,may,present,feasible,solution,solve,problems,formation,efficiency,inevitable,Cu3Sn,packaging,applications
AB值：
0.374027
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