With the trends of miniaturization and high density of electronic packaging,there has been an urgent demand to open up lead-free solders with high strength and ductility.In this study,a ZrO2-reinforced Sn1.0Ag0.5Cu composite solder was designed.First,surface modification on ZrO2 was conducted with ball milling-pyrolysis method.Subsequently,NiO modified ZrO2(NiO/ZrO2)was added to the solder ma-trix with ultrasonic stirring.The morphology and interface of NiO/ZrO2 were discussed.Moreover,the microstructure,interface and mechanical properties of the composite solders were systematically studied.The results showed that NiO nanoparticles were evenly adhered to the ZrO2 surface,and the interface re-lationship between them was semi-coherent and coherent.Further,an appropriate addition of NiO/ZrO2 could refine the microstructure of composite solders.The refinement mechanism was systematically in-vestigated.Besides,a micro-mechanical lock and non-micropored clean interface was formed between NiO/ZrO2 and the solder matrix.The Sn/NiO/ZrO2 interface system based on mutual solid solution was ingeniously designed.The ultimate tensile strength and elongation were increased synergistically,and the fracture mechanism transformed from a ductile-brittle mixed fracture mode to a ductile fracture mode.Therefore,a lead-free solder with high strength and ductility was obtained.

Fupeng Huo;Zhi Jin;Duy Le Han;Jiahui Li;Keke Zhang;Hiroshi Nishikawa

Joining and Welding Research Institute,Osaka University,Ibaraki,Osaka 565-0047,Japan;Graduate School of Engineering Osaka University,Suita,Osaka 565-0871,Japan;Department of Welding Engineering and Metals Technology,School of Mechanical Engineering,Hanoi University of Science and Technology,No.1 Dai Co Viet,Hai Ba Trung,Hanoi,Viet Nam;School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471023,China

材料科学技术（英文版）

[1]Fupeng Huo;Zhi Jin;Duy Le Han;Jiahui Li;Keke Zhang;Hiroshi Nishikawa-.Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2:Microstructure and mechanical properties)[J].材料科学技术（英文版）,2022(30):157-170

solders,micropored

Novel,interface,regulation,Sn1,0Ag0,5Cu,composite,reinforced,modified,ZrO2,Microstructure,mechanical,properties,With,trends,miniaturization,high,density,electronic,packaging,there,has,been,urgent,demand,open,up,lead,free,strength,ductility,In,this,study,was,designed,First,surface,modification,conducted,ball,milling,pyrolysis,method,Subsequently,NiO,added,ultrasonic,stirring,morphology,were,discussed,Moreover,microstructure,systematically,studied,results,showed,that,nanoparticles,evenly,adhered,lationship,between,them,semi,coherent,Further,appropriate,addition,could,refinement,mechanism,vestigated,Besides,lock,clean,matrix,mutual,solid,solution,ingeniously,ultimate,tensile,elongation,increased,synergistically,fracture,transformed,from,ductile,brittle,mixed,mode,Therefore,obtained

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