典型文献
Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test
文献摘要：
The excellent properties of SiC bring new challenges for the device packaging. In this study, the bonding strength, fracture beha-viors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling (–50 oC–250 oC) in SiC/DBC (direct bonding copper) die attachment structure for different time. During harsh thermal shock test, the strength of sintered joint deceased gradu-ally with the increase of cycling number, and the value just was half of the value of as-sintered after 1000 cycles. Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing, which were the reasons of the strength de-cease. In addition, it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1000 cycles. This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature.
文献关键词：
中图分类号：
作者姓名：
陈传彤;张浩;酒金婷;龙旭;菅昭克昭
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引用格式：
[1]陈传彤;张浩;酒金婷;龙旭;菅昭克昭-.Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test)[J].中国焊接（英文版）,2022(01):15-21
A类：
viors,Coarsening
B类：
Thermal,fatigue,behaviors,SiC,power,module,by,Ag,joining,harsh,thermal,shock,test,excellent,properties,bring,new,challenges,device,packaging,In,this,study,bonding,strength,fracture,microstructural,evolution,micron,porous,were,elevated,during,cycling,oC,DBC,direct,copper,die,attachment,structure,different,During,sintered,deceased,gradu,ally,increase,number,value,just,was,half,after,cycles,grains,observed,inhomogeneity,defects,increasing,which,reasons,addition,also,found,that,joints,changed,from,ductile,deformation,brittle,crack,propagation,This,will,understanding,mechanical,its,applications,high,temperature
AB值：
0.541265
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