典型文献
Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity
文献摘要：
The development of lightweight and integration for electronics requires flexible films with high thermal con-ductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution.Herein,the hierarchi-cal design and assembly strat-egy was adopted to fabricate hierarchically multifunctionalpolyimide composite films,with graphene oxide/expanded graphite (GO/EG) as the top thermally conductive and EMI shielding layer,Fe3O4/polyimide (Fe3O4/PI) as the middle EMI shielding enhancement layer and electrospun PI fibers as the substrate layer for mechani-cal improvement.PI composite films with 61.0 wt％ of GO/EG and 23.8 wt％ of Fe3O4/PI exhibits high in-plane thermal conductivity coefficient (95.40 W (m K)-1),excellent EMI shielding effectiveness (34.0 dB),good tensile strength (93.6 MPa) and fast electric-heating response (5 s).The test in the central processing unit verifies PI composite films present broad application prospects in electronics fields.
文献关键词：
中图分类号：
作者姓名：
Yongqiang Guo;Hua Qiu;Kunpeng Ruan;Yali Zhang;Junwei Gu
作者机构：
Shaanxi Key Laboratory of Macromolecular Science and Technology,School of Chemistry and Chemical Engineering,Northwestern Polytechnical University,Xi'an 710072,Shaanxi,People's Republic of China
文献出处：
引用格式：
[1]Yongqiang Guo;Hua Qiu;Kunpeng Ruan;Yali Zhang;Junwei Gu-.Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity)[J].纳微快报（英文）,2022(02):94-106
A类：
multifunctionalpolyimide
B类：
Hierarchically,Multifunctional,Polyimide,Composite,Films,Strongly,Enhanced,Thermal,Conductivity,development,lightweight,integration,electronics,requires,flexible,films,high,electromagnetic,interference,EMI,shielding,overcome,accumulation,radiation,pollution,Herein,design,assembly,egy,was,adopted,fabricate,hierarchically,composite,graphene,oxide,expanded,graphite,EG,top,thermally,conductive,layer,Fe3O4,middle,enhancement,electrospun,fibers,substrate,mechani,improvement,wt,exhibits,plane,conductivity,coefficient,excellent,effectiveness,dB,good,tensile,strength,fast,electric,heating,response,test,central,processing,unit,verifies,present,broad,application,prospects,fields
AB值：
0.596446
相似文献
机标中图分类号，由域田数据科技根据网络公开资料自动分析生成，仅供学习研究参考。
