典型文献
Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion
文献摘要：
The microstructure,mechanical performance,and electrical conductivity of Cu-Te alloy fabricated by continuous extrusion were quantitatively investigated.The results demonstrate that the grain size of the Cu-Te alloy is refined significantly by incomplete dynamic recrystallization.The Cu2Te phase stim-ulates recrystallization and inhibits subgrain growth.After extrusion,the tensile strength increases from 217.8±4.8 MPa to 242.5±3.7 MPa,the yield strength increases from 65.1±3.5 MPa to 104.3±3.8 MPa,and the yield to tensile strength ratio is improved from 0.293±0.015 to 0.43±.0.091,while the electri-cal conductivity of room temperature decreases from 95.8±0.38％International Annealed Cu Standard(IACS)to 94.0％±0.32％IACS.The quantitative analysis shows that the increment caused by dislocation strengthening and boundary strengthening account for 84.6％of the yield strength of the extruded Cu-Te alloy and the electrical resistivity induced by grain boundaries and dislocations accounts for 1.6％of the electrical resistivity of the extruded Cu-Te alloy.Dislocations and boundaries contribute greatly to the increase of yield strength,but less to the increase of electrical resistivity.
文献关键词：
中图分类号：
作者姓名：
Qianqian Fu;Bing Li;Minqiang Gao;Ying Fu;Rongzhou Yu;Changfeng Wang;Renguo Guan
作者机构：
Liaoning Key Laboratory of Near-Net Shape Forming of Light Metal Materials,Dalian Jiaotong University,Dalian 116028,China;Shanxi Datong University,Datong 037009,China;Engineering Research Center of Continuous Extrusion,Ministry of Education,Dalian Jiaotong University,Dalian 116028,China;Songshan Lake Materials Laboratory,Dongguan 523808,China
文献出处：
引用格式：
[1]Qianqian Fu;Bing Li;Minqiang Gao;Ying Fu;Rongzhou Yu;Changfeng Wang;Renguo Guan-.Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion)[J].材料科学技术（英文版）,2022(26):9-18
A类：
Annealed,Dislocations
B类：
Quantitative,mechanisms,behind,high,electrical,conductivity,alloy,manufactured,by,continuous,extrusion,microstructure,mechanical,performance,fabricated,were,quantitatively,investigated,results,demonstrate,that,size,refined,significantly,incomplete,dynamic,recrystallization,Cu2Te,phase,stim,ulates,inhibits,subgrain,growth,After,tensile,increases,from,yield,ratio,improved,while,room,temperature,decreases,International,Standard,IACS,analysis,shows,increment,caused,strengthening,boundary,extruded,resistivity,induced,boundaries,dislocations,accounts,contribute,greatly,less
AB值：
0.432507
相似文献
机标中图分类号，由域田数据科技根据网络公开资料自动分析生成，仅供学习研究参考。
