典型文献
Fabrication of High-Density Out-of-Plane Microneedle Arrays with Various Heights and Diverse Cross-Sectional Shapes
文献摘要:
Out-of-plane microneedle structures are widely used in various applications such as transcutaneous drug delivery and neural signal recording for brain machine interface.This work presents a novel but simple method to fabri-cate high-density silicon (Si) microneedle arrays with various heights and diverse cross-sectional shapes depending on photomask pattern designs.The proposed fabrication method is composed of a single photolithography and two subsequent deep reactive ion etching (DRIE) steps.First,a photoresist layer was patterned on a Si substrate to define areas to be etched,which will eventually determine the final location and shape of each individual microneedle.Then,the 1st DRIE step created deep trenches with a highly anisotropic etching of the Si substrate.Subsequently,the photoresist was removed for more isotropic etching;the 2nd DRIE isolated and sharpened microneedles from the predefined trench structures.Depending on diverse photomask designs,the 2nd DRIE formed arrays of microneedles that have various height distributions,as well as diverse cross-sectional shapes across the substrate.With these simple steps,high-aspect ratio microneedles were created in the high density of up to 625 microneedles mm-2 on a Si wafer.Insertion tests showed a small force as low as ~ 172 μN/microneedle is required for microneedle arrays to penetrate the dura mater of a mouse brain.To demonstrate a feasibility of drug delivery application,we also implemented silk microneedle arrays using molding processes.The fabrication method of the present study is expected to be broadly applicable to create microneedle structures for drug delivery,neuroprosthetic devices,and so on.
文献关键词:
中图分类号:
作者姓名:
Hyeonhee Roh;Young Jun Yoon;Jin Soo Park;Dong-Hyun Kang;Seung Min Kwak;Byung Chul Lee;Maesoon Im
作者机构:
Brain Science Institute,Korea Institute of Science and Technology (KIST),Seoul 02792,South Korea;Division of Electrical Engineering,College of Engineering,Korea University,Seoul 02841,South Korea;Micro/Nano Fabrication Center,KIST,Seoul 02792,South Korea;Division of Bio-Medical Science & Technology,KIST School,University of Science & Technology (UST),Seoul 02792,South Korea
文献出处:
引用格式:
[1]Hyeonhee Roh;Young Jun Yoon;Jin Soo Park;Dong-Hyun Kang;Seung Min Kwak;Byung Chul Lee;Maesoon Im-.Fabrication of High-Density Out-of-Plane Microneedle Arrays with Various Heights and Diverse Cross-Sectional Shapes)[J].纳微快报(英文),2022(02):60-78
A类:
Microneedle,photomask,photolithography,DRIE,photoresist,neuroprosthetic
B类:
Fabrication,High,Density,Out,Plane,Arrays,Various,Heights,Diverse,Cross,Sectional,Shapes,plane,structures,widely,used,various,applications,such,transcutaneous,drug,delivery,neural,signal,recording,brain,machine,interface,This,work,presents,novel,simple,method,cate,density,silicon,Si,arrays,heights,diverse,sectional,shapes,depending,designs,proposed,fabrication,composed,single,two,subsequent,deep,reactive,etching,steps,First,layer,was,patterned,substrate,areas,be,etched,which,will,eventually,determine,final,location,each,individual,Then,1st,created,trenches,highly,anisotropic,Subsequently,removed,more,2nd,isolated,sharpened,microneedles,from,predefined,Depending,formed,that,have,distributions,well,across,With,these,aspect,ratio,were,up,wafer,Insertion,tests,showed,small,force,low,required,penetrate,dura,mater,mouse,To,demonstrate,feasibility,also,implemented,silk,using,molding,processes,study,expected,broadly,applicable,devices
AB值:
0.513664
相似文献
机标中图分类号,由域田数据科技根据网络公开资料自动分析生成,仅供学习研究参考。