The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface.The paper investigates the heat transport behavior between a 200-nm Cu layer and a single-crystalline diamond substrate inserted by a chromium(Cr)interlayer having a series of thicknesses from 150 nm down to 5 nm.The pur-pose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance(h)between Cu and diamond.The time-domain thermoreflectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and dia-mond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond.The h value exhibits a de-creasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer.The high h values are ob-served for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr lay-er.The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface,which plays a pivotal role in designing materials and devices for thermal management applications.

Xiaoyan Liu;Fangyuan Sun;Wei Wang;Jie Zhao;Luhua Wang;Zhanxun Che;Guangzhu Bai;Xitao Wang;Jinguo Wang;Moon J.Kim;Hailong Zhang

State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,Beijing 100083,China;School of Energy and Environmental Engineering,University of Science and Technology Beijing,Beijing 100083,China;Beijing Institute of Structure and Environment Engineering,Beijing 100076,China;Department of Materials Science and Engineering,University of Texas at Dallas,Richardson,TX 75080,USA;Institute of Engineering Thermophysics,Chinese Academy of Sciences,Beijing 100190,China;Shandong Provincial Key Laboratory for High Strength Lightweight Metallic Materials,Advanced Materials Institute,Qilu University of Technology(Shandong Academy of Sciences),Jinan 250014,China;Collaborative Innovation Center of Steel Technology,University of Science and Technology Beijing,Beijing 100083,China

矿物冶金与材料学报

[1]Xiaoyan Liu;Fangyuan Sun;Wei Wang;Jie Zhao;Luhua Wang;Zhanxun Che;Guangzhu Bai;Xitao Wang;Jinguo Wang;Moon J.Kim;Hailong Zhang-.Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface)[J].矿物冶金与材料学报,2022(11):2020-2031

thermoreflectance

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