典型文献
Dielectric AlN/epoxy and SiC/epoxy composites with enhanced thermal and dynamic mechanical properties at low temperatures
文献摘要：
In a superconducting magnet,the thermal properties of the insulating material at low temperatures is an important technical index to ensure the normal operation of a superconducting coil.Herein,a low-temperature thermal conductivity testing device with a tiny uncertainty was developed to measure the composites.Further-more,SiC/epoxy and AlN/epoxy composites were prepared and their properties were tested at low temperatures.The results showed that the composites have a better thermal conductivity at low temperatures than pure epoxy.In addition,the AlN/epoxy and SiC/epoxy composites have excellent dynamic mechanical properties and low coefficient of thermal expansion.Due to the fair thermal and dynamic mechanical properties,the composites will have potential application in the superconducting magnet.
文献关键词：
中图分类号：
作者姓名：
Zhengrong Zhou;Rongjin Huang;Huiming Liu;Yalin Zhao;Zhicong Miao;Zhixiong Wu;Wanyin Zhao;Chuanjun Huang;Laifeng Li
作者机构：
State Key Laboratory of Technologies in Space Cryogenic Propellants,Technical Institute of Physics and Chemistry,Chinese Academy of Sciences,Beijing,100190,China;Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing,100049,China
文献出处：
引用格式：
[1]Zhengrong Zhou;Rongjin Huang;Huiming Liu;Yalin Zhao;Zhicong Miao;Zhixiong Wu;Wanyin Zhao;Chuanjun Huang;Laifeng Li-.Dielectric AlN/epoxy and SiC/epoxy composites with enhanced thermal and dynamic mechanical properties at low temperatures)[J].自然科学进展·国际材料（英文）,2022(03):304-313
A类：
B类：
Dielectric,AlN,epoxy,SiC,composites,enhanced,thermal,dynamic,mechanical,properties,low,temperatures,In,superconducting,magnet,insulating,material,is,important,technical,ensure,normal,operation,coil,Herein,conductivity,testing,device,tiny,uncertainty,was,developed,measure,Further,more,were,prepared,their,tested,results,showed,that,have,better,than,pure,addition,excellent,coefficient,expansion,Due,fair,will,potential,application
AB值：
0.463386
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