典型文献
Antenna-in-Package (AiP) Technology
文献摘要：
1. Introduction
Since the mid-1990s, the complementary metal oxide semicon-ductor (CMOS) has been the technological driver for the wireless revolution [1], enabling the full system-on-chip (SoC) integration of Bluetooth radios, 60 GHz radios, and 79 GHz radar. In fact, the CMOS is now the dominant semiconductor technology for the fifth generation (5G) New Radio (NR) [2].
文献关键词：
中图分类号：
作者姓名：
Yueping Zhang
作者机构：
School of Electrical and Electronic Engineering,Nangyang Technological University,Singapore 639798,Singapore
文献出处：
引用格式：
[1]Yueping Zhang-.Antenna-in-Package (AiP) Technology)[J].工程（英文）,2022(04):18-20
A类：
radios
B类：
Antenna,Package,AiP,Technology,Introduction,
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AB值：
0.708686
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