典型文献
Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application
文献摘要：
To meet the processing requirements of resin transfer moulding (RTM) technology,reactive diluent containing m-phenylene moiety was synthesized to physically mixed with phenylethynyl terminated cooligoimides with well-designed molecular weights of 1500-2500 g/mol derived from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA),3,4'-oxydianiline (3,4'-ODA) and m-phenylenediamine (m-PDA).This blend shows low minimum melting viscosity (＜1 Pa·s) and enlarged processing temperature window (260-361 ℃).FPI-R-1 stays below 1 Pa·s for 2 h at 270 ℃.The relationship between the molecular weight of the blend and its melting stability was first explored.Blending oligoimides with lower molecular weights exhibit better melting stability.Upon curing at 380 ℃ for 2 h,the thermosetting polyimide resin demonstrates superior heat resistance (Tg=420-426 ℃).
文献关键词：
中图分类号：
作者姓名：
Wei-Jie Hong;Li-Li Yuan;Hao-Yang Zhang;Chao Cui;Wei Chen;Shi-Yong Yang
作者机构：
Key Laboratory of Science and Technology on High-tech Polymer Materials,Chinese Academy of Sciences,Beijing 100190,China;School of Chemical Engineering,University of Chinese Academy of Sciences,Beijing 100049,China;Astronautical Systems Engineering Technology,Beijing 100076,China;Aerospace Research Institute of Materials & Processing Technology,Beijing 100076,China
文献出处：
引用格式：
[1]Wei-Jie Hong;Li-Li Yuan;Hao-Yang Zhang;Chao Cui;Wei Chen;Shi-Yong Yang-.Phenylethynyl-terminated Imide Oligomers Modified by Reactive Diluent for Resin Transfer Molding Application)[J].高分子科学（英文版）,2022(01):107-120
A类：
Phenylethynyl,Imide,Oligomers,Diluent,phenylethynyl,cooligoimides,hexafluoroisopropylidene,diphthalic,oxydianiline,oligoimides
B类：
terminated,Modified,by,Reactive,Resin,Transfer,Molding,Application,To,meet,processing,requirements,resin,transfer,moulding,RTM,technology,reactive,diluent,containing,moiety,was,synthesized,physically,mixed,well,designed,molecular,weights,derived,from,anhydride,6FDA,ODA,phenylenediamine,PDA,This,blend,shows,minimum,melting,viscosity,Pa,enlarged,temperature,window,FPI,stays,below,relationship,between,its,stability,first,explored,Blending,lower,exhibit,better,Upon,curing,thermosetting,polyimide,demonstrates,superior,heat,resistance,Tg
AB值：
0.616612
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机标中图分类号，由域田数据科技根据网络公开资料自动分析生成，仅供学习研究参考。
