典型文献
Recent progress on thermal conductivity of graphene filled epoxy composites
文献摘要:
With the rapid development of the electronic industry, the requirements for packaging materials with high thermal conductivity (TC) are getting higher and higher. Epoxy is widely used as package material for electronic package applications. But it's intrinsic TC can't meets the increasing demands. Adding high TC graphene into epoxy matrix is a proper way to reinforce epoxy composites. This review focuses on the filler modification, preparation process and thermal properties of graphene-filled epoxy resin composites. Different ways of covalent and non-covalent modification methods are discussed. The various kinds of graphene coating layer are also summarized. Then we analysis the hybrid filler system in epoxy composite. We hope this review will provide guidance for the development and application of graphene-filled epoxy resin composites.
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作者姓名:
Ruicong Lv;Yanjuan Ren;Haichang Guo;Shulin Bai
作者机构:
School of Materials Science and Engineering, HEDPS/Center for Applied Physics and Technology, Key Laboratory of Polymer Chemistry and Physics of Ministry of Education, Peking University, Beijing, 100871, China
文献出处:
引用格式:
[1]Ruicong Lv;Yanjuan Ren;Haichang Guo;Shulin Bai-.Recent progress on thermal conductivity of graphene filled epoxy composites)[J].纳米材料科学(英文版),2022(03):205-219
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AB值:
0.545991
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