典型文献
Research progress in interface modification and thermal conduction behavior of diamond/metal composites
文献摘要：
Diamond/metal composites are widely used in aerospace and electronic packaging fields due to their outstanding high thermal con-ductivity and low expansion. However, the difference in chemical properties leads to interface incompatibility between diamond and metal, which has a considerable impact on the performance of the composites. To improve the interface compatibility between diamond and metal, it is necessary to modify the interface of composites. This paper reviews the experimental research on interface modification and the application of computational simulation in diamond/metal composites. Combining computational simulation with experimental methods is a promising way to promote diamond/metal composite interface modification research.
文献关键词：
中图分类号：
作者姓名：
Ping Zhu;Pingping Wang;Puzhen Shao;Xiu Lin;Ziyang Xiu;Qiang Zhang;Equo Kobayashi;Gaohui Wu
作者机构：
School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China;Key Laboratory of Advanced Structure-Function Integrated Materials and Green Manufacturing Technology,School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001,China;Industrial Technology Research Institute of Heilongjiang Province,Harbin 150001,China;Department of Materials Science and Engineering,Tokyo Institute of Technology,Tokyo 152-8550,Japan
文献出处：
引用格式：
[1]Ping Zhu;Pingping Wang;Puzhen Shao;Xiu Lin;Ziyang Xiu;Qiang Zhang;Equo Kobayashi;Gaohui Wu-.Research progress in interface modification and thermal conduction behavior of diamond/metal composites)[J].矿物冶金与材料学报,2022(02):200-211
A类：
B类：
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AB值：
0.534137
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