典型文献
Preliminary Investigation of Copper Joints Soldered with Sn58Bi
文献摘要：
In recent years, intensive studies have been carried out to find an alternative for Tin ( Sn)-Lead ( Pb ) solder alloys with increasing demand over lower temperature solder alloys in current electronic packaging industry. High temperature operational solder alloys seem to produce drawback to other components on the printed circuit board ( PCB) . Low melting temperature Sn58Bi substrate as a potential replacement was investigated in this paper based on the melting properties, wettability, and shear strength. The Sn58Bi was soldered at a temperature below 200 ℃ on the Cu substrate, and the shear strength and contact angle were calculated. A peak temperature ( melting temperature, TM ) of 144. 83 ℃ was identified. Single lap joint method was performed at a strain rate of 0.1 mm/min and an average shear strength of 23.4 MPa was found from three samples. The contact angle ( wettability ) was calculated to study the solder joint behaviour at reflow temperature of 170 ℃. The contact angle of the Sn58Bi was found to be 32.4 ° and considered to be desired value since the angle is less than 50 ° . The low temperature soldering provides a preliminary result to allow further application on the real PCB.
文献关键词：
中图分类号：
作者姓名：
Amares Singh;Teow Sinn Khai;Rajkumar Durairaj;Amer Ahmed Qassem Saleh
作者机构：
Center for Advanced Materials Research and Manufacturing Processes,SEGi University,Petaling Jaya 47810,Selangor,Malaysia;Lee Kong Chian Faculty of Engineering and Science,University Tunku Abdul Rahman,Kajang 43000,Selangor,Malaysia
文献出处：
引用格式：
[1]Amares Singh;Teow Sinn Khai;Rajkumar Durairaj;Amer Ahmed Qassem Saleh-.Preliminary Investigation of Copper Joints Soldered with Sn58Bi)[J].哈尔滨工业大学学报（英文版）,2022(01):57-63
A类：
Soldered,soldered
B类：
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AB值：
0.53407
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