典型文献
Ceramic-copper substrate technology introduction
文献摘要：
Ceramic-copper substrate is used to achieve the combination between copper and ceramic (Al2O3 or AlN) under high temperat-ures by bonding or brazing process, then through dedicate lamination ? etching technology to develop the designed layout in copper surface, finally parts go with plating and singulation process for surface treatment before shipping to the end-user. Ceramic-copper substrate has per-fect performance in terms of insulation, thermal conductivity, solderability, and adhesion strength. Besides, the copper on surface can afford huge current due to the fact that ceramic has good reliability and thermal-cycling performance. According to technical visit and audit to sup-pliers' manufacturing process and based on several years' experience of mass production for electric vehicle power module package, this art-icle introduces two mainstream ceramic-copper substrate processing methods currently on the market: direct bond copper (DBC) and active metal brazing (AMB) which can be widely used for the intelligent power module and electric vehicle power module, also introduces the ma-jor failure mode during application and analyzes the root cause for each failure mode, clarifies key incoming monitoring method, like crosshatch, silver plating thickness measurement and blister test. This article also clarifies the Incoming Quality Control system, which can provide guidance to process engineer during the application.
文献关键词：
中图分类号：
作者姓名：
赵清清;孙文韬
作者机构：
文献出处：
引用格式：
[1]赵清清;孙文韬-.Ceramic-copper substrate technology introduction)[J].中国焊接（英文版）,2022(02):56-64
A类：
dedicate,singulation,solderability,pliers,icle,crosshatch
B类：
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AB值：
0.580357
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