典型文献
Atomistic simulation on the generation of defects in Cu/SiC composites during cooling
文献摘要：
The coefficient of thermal expansion(CTE)mismatch between the reinforcement and the matrix results in thermal residual stresses and defects within metal-matrix composites(MMCs)upon cooling from the processing temperature to ambient temperature.The residual stresses and thermally induced defects play an important role in the mechanical properties of MMCs,it is critical to understand the mechanism of defect formation and evolution.This study provides atomistic simulations to reveal the generation of thermal residual stresses,dislocation and incomplete stacking fault tetrahedron(ISFT)during cooling in the idealized Cu/SiC composites.We found that dislocations are generated explosively in a certain tem-perature range during cooling,which results in a non-linear relationship between dislocation density and temperature.The combined effect of the stresses induced by CTE mismatch and the thermodynamic state of the metal leads to the rapid generation of dislocations.The Shockley partial and the highly stable stair rod are the two dominant dislocation structures.The immobile stair-rod dislocations and the highly stable ISFTs formed in the initial high temperature stage inhibit further development of plastic deforma-tion.The present results provide new insights into the defect formation mechanism and the dislocation strengthening mechanism of MMCs caused by thermal mismatch between constituents.
文献关键词：
中图分类号：
作者姓名：
Yongnan Xiong;Wangyu Hu;Yao Shu;Xing Luo;Zhibo Zhang;Jiazhen He;Cuicui Yin;Kaihong Zheng
作者机构：
Guangdong Academy of Sciences,Institute of New Materials,Guangzhou 510651,China;Guangdong Provincial Key Laboratory of Metal Toughening Technology and Application,Guangzhou 510561,China;College of Materials Science and Engineering,Hunan University,Changsha 410082,China
文献出处：
引用格式：
[1]Yongnan Xiong;Wangyu Hu;Yao Shu;Xing Luo;Zhibo Zhang;Jiazhen He;Cuicui Yin;Kaihong Zheng-.Atomistic simulation on the generation of defects in Cu/SiC composites during cooling)[J].材料科学技术（英文版）,2022(28):1-12
A类：
Atomistic,ISFT,ISFTs
B类：
generation,defects,SiC,composites,during,cooling,coefficient,expansion,CTE,mismatch,between,reinforcement,matrix,results,residual,stresses,within,metal,MMCs,upon,from,processing,temperature,ambient,thermally,induced,play,important,role,mechanical,properties,critical,understand,mechanism,formation,evolution,This,study,provides,atomistic,simulations,reveal,incomplete,stacking,fault,tetrahedron,idealized,We,found,that,dislocations,are,generated,explosively,certain,range,which,linear,relationship,density,combined,effect,by,thermodynamic,state,leads,rapid,Shockley,partial,highly,stable,stair,rod,two,dominant,structures,immobile,formed,initial,stage,inhibit,further,development,plastic,deforma,present,new,insights,into,strengthening,caused,constituents
AB值：
0.490481
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