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典型文献
Enhanced thermal conductivity and microwave dielectric properties by mesostructural design of multiphase nanocomposite
文献摘要:
Next-generation packaging materials are expected to have higher thermal conductivity,because the heat accu-mulated in high-performance electronic equipment should be removed to increase the service life of the equip-ment.At the same time,the dielectric loss of the material needs to be reduced to lessen signal delay and attenuation,especially for the applications under high frequency.In this work,we introduce nano-silicon carbide(SiC)and carbon nanotubes(CNTs)into the polystyrene(PS)and poly(methyl methacrylate)(PMMA)blends system.The design of two-way migration at the interface of CNTs and SiC nanoparticles is realized through the masterbatch method and processing technology control.As a result,the thermal conductivity is successfully increased up to 75%.Meanwhile,compared to the CNTs single-phase migration system,it effectively reduces the dielectric loss of the nanocomposite and optimizes the electrical insulation.This work has significant practical application value in the design of electronic device substrates and packaging materials,and provides an inno-vative methodology for the mesostructure design of multiphase nanocomposites.
文献关键词:
作者姓名:
Liping Zhou;Peng Xu;Faxiang Qin
作者机构:
Institute for Composites Science Innovation(InCSI),School of Materials Science and Engineering,Zhejiang University,38 Zheda Road,Hangzhou,310027,PR China
引用格式:
[1]Liping Zhou;Peng Xu;Faxiang Qin-.Enhanced thermal conductivity and microwave dielectric properties by mesostructural design of multiphase nanocomposite)[J].纳米材料科学(英文版),2022(02):133-138
A类:
mesostructural
B类:
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AB值:
0.605246
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