典型文献
A review of thermal rectification in solid-state devices
文献摘要：
Thermal rectification,or the asymmetric transport of heat along a structure,has recently been investigated as a poten-tial solution to the thermal management issues that accompany the miniaturization of electronic devices.Applications of this concept in thermal logic circuits analogous to existing electronics-based processor logic have also been proposed.This review highlights some of the techniques that have been recently investigated for their potential to induce asymmetric thermal con-ductivity in solid-state structures that are composed of materials of interest to the electronics industry.These rectification ap-proaches are compared in terms of their quantitative performance,as well as the range of practical applications that they would be best suited to.Techniques applicable to a range of length scales,from the continuum regime to quantum dots,are dis-cussed,and where available,experimental findings that build upon numerical simulations or analytical predictions are also high-lighted.
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作者姓名：
Faraz Kaiser Malik;Kristel Fobelets
作者机构：
Department of Electrical and Electronic Engineering,Imperial College London,SW7 2BT,United Kingdom
文献出处：
引用格式：
[1]Faraz Kaiser Malik;Kristel Fobelets-.A review of thermal rectification in solid-state devices)[J].半导体学报（英文版）,2022(10):23-40
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0.620567
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