Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree,operation frequency and power density,and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials.Compared to the conventional thermal management materials,flexible ther-mally conductive films with high in-plane thermal conductivity,as emerging candidates,have aroused greater interest in the last decade,which show great potential in thermal management applications of next-generation devices.However,a comprehensive review of flexible thermally conductive films is rarely reported.Thus,we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity,with deep understandings of heat transfer mechanism,pro-cessing methods to enhance thermal conductivity,optimization strategies to reduce interface thermal resistance and their potential applications.Lastly,challenges and opportunities for the future development of flexible thermally conductive films are also discussed.

Shandong Engineering Research Center for Additive Manufacturing,Qingdao University of Technology,Qingdao 266520,People's Republic of China;State Key Laboratory of Polymer Materials Engineering,College of Polymer Science and Engineering,Sichuan University,Chengdu 610065,People's Republic of China;Institute of Electrical Engineering,Chinese Academy of Sciences,Beijing 100190,People's Republic of China

[1]Chang-Ping Feng;Fang Wei;Kai-Yin Sun;Yan Wang;Hong-Bo Lan;Hong-Jing Shang;Fa-Zhu Ding;Lu Bai;Jie Yang;Wei Yang-.Emerging Flexible Thermally Conductive Films:Mechanism,Fabrication,Application)[J].纳微快报（英文）,2022(08):24-57

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